Quality & Certification

Building a product-testing and quality-control system to laboratory standards, so every domestic device is reliable and traceable.

Quality System

End-to-end quality control from design to delivery

Our Suining, Sichuan plant hosts the R&D centre and technical service team, a packaging & test foundry and an alloy-wire material plant, staffed by a team with deep professional knowledge and hands-on process tuning capability.

01

Enterprise test standards

Product testing standards and a quality system aligned with CNAS and TUV laboratory standards, covering electrical performance, reliability and failure-analysis capability.

02

Multi-system certification

Certified to ISO 9001 quality management, IATF 16949 automotive quality management, ISO 45001 occupational health & safety, and GJB9001C-2017.

03

Cleanroom manufacturing & consistency

The Suining packaging & test plant runs dedicated production lines, operating in dual self-developed-brand and agency modes, with traceability down to the batch level.

Certifications

Certifications & standards

Accumulated qualifications and system certifications over more than a decade.

ISO 9001 : 2025 quality management systemIATF 16949 : 2025 automotive quality management systemISO 45001 : 2025 occupational health and safety management systemGJB9001C-2017 weapons equipment quality management system
R & D

R&D & technology

TDSEMIC was founded in 2011 and focuses on the production and sales of integrated circuits, operating in dual self-developed-brand and agency modes, covering wafer design and tape-out, IC packaging and test, and IC solution development and sales.

Industry-chain collaboration

A coordinated "Chengdu wafer design + Suining packaging & manufacturing" setup connects the full chain from chip design to volume delivery:

Chengdu wafer design

Takes custom IC development and packaging/test service orders, and delivers system solutions with independent intellectual property.

Suining packaging & test plant

A packaging & test foundry and alloy-wire material plant established in 2010, handling IC and discrete packaging, testing and volume delivery.

Product coverage

Packages span SOT / SOD / QFN / DFN / TO / SOP and other mainstream formats, widely used across consumer electronics, communications, power electronics and industrial control.

Compliance & responsibility

We operate with integrity and ethical sourcing, comply with product quality, environmental, health & safety and business-ethics regulations, and treat corporate social responsibility as a long-term goal to drive sustainable development of the industrial chain.